Specifications
Insulation Resistance:1,000MΩ min. at 100V DC
Dielectric Withstanding Voltage:100V AC for 1 minute
Contact Resistance:100mΩ max. at 10mA/20mV max.
Operating Temperature Range:–40°C to +150°C / -55°C to +150°C
Contact Force:15g per pin approx.
Mating Cycles:10,000 insertions minimun
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Features
Open top type socket for CSP packages with 0.50mm pitch
Self contacting structure without upper pressing force (ZIF)
Fan-out?Terminal type, designed to reduce ball damage
Outline Base Socket Dimensions
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